353ND AB glue resin epon fiber polish glue fiber polishing tool
Two component heat curing epoxy adhesive, also known 353ND fiber bonding agent for the production of optical component,widely used in the production of fiber optic connectors.
Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.
NASA approved, low outgassing epoxy
Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
Hybrid suggested applications: providing near hermetic seals in sensor devices, resisting high temperature packaging
Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions
Fiber optic adhesive designed to meet Telecordia 1221 – suggested applications:
Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range
Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays